The highly adaptable microFLEX™ product family from 3D-Micromac is known as the all-inclusive solution for laser processing of flexible thin films in electronics, photovoltaics, semiconductors, medical devices, and displays.
The production systems have the potential to tackle several substrates, material thicknesses, and types like stainless steel, thin glass, and polymer films.
The microFLEX™ systems integrate high-precision laser processing with the cleaning and packaging technologies, along with inline quality control. As a result of its modular concept, several tailored solutions are available, from industrial mass production to pilot lines to applied research.
Highlights
- High throughput and productivity: on-the-fly processing, high machine uptime, contactless substrate guiding and multiple tension controllers.
- Maximum flexibility: simple machine layout modification by adopting the modular machine platform.
- Great versatile micromachining system: suitable with all laser processes.
- Cost benefits: long-term security of investment; simple to upgrade and modify; reasonable cost of ownership; different microenvironments.
3D-Micromac’s microFLEX R2R laser micromachining system. Image Credit: 3D-Micromac AG
Roll-to-roll laser machining for forceless and contactless processing with highest precision. Image Credit: 3D-Micromac AG
Laser machining of flexible solar cells in a roll-to-roll (R2R) process for monolithic interconnection to serially connected submodules in P1, P2 and P3 process steps. Image Credit: 3D-Micromac AG
An R2R machining area for the processing of flexible sensors using an excimer laser. Image Credit: 3D-Micromac AG
microFLEX™ - Roll to Roll Laser System for Processing of Flexible Substrates
Video Credit:3D-Micromac AG