Seminar on Plasma Process Technology Held at SENTECH

SENTECH提供基于椭圆测量法的蚀刻和沉积和薄膜测量仪器的前缘等离子体工艺技术设备。2020欧洲杯下注官网先进的Sentech等离子体设备基于电感耦合等离子体源P2020欧洲杯下注官网TSA(平面三螺旋天线),该等离子体是由Sentech开发的,用于低损伤和高速率蚀刻和沉积。Sentech的最新产品开发扩展了ALD和等离子体增强ALD系统的ICPECVD产品系列。

Sentech大楼前的小组图片

SENTECH has organized a seminar on Plasma Process Technology on February 27, 2014 held at SENTECH Instruments in Berlin Adlershof. The seminar offers great networking opportunities for specialists of the thin film plasma community. The Seminar was already the 8th plasma seminar and attracted more than 50 specialists from industry, research institutions and universities.

The group picture was taken during lunch break in front of the SENTECH building in Berlin Adlershof.

在血浆蚀刻的最新研讨会上,在血浆增强的沉积和原子层沉积中,被邀请的演讲者和Sentech仪器的专家提出。

One of the outstanding highlights of this event was the presentation on ALD combined with PECVD of Mr Bülow from TU Brunswick. The combination of ALD and PECVD in one SENTECH tool enables remarkable OLED encapsulation.

A presentation on Si etching application held by Mr Voigt from Leibnitz Institute for Photonic Technologies, Jena underlined the high efficiency of Si etching with SENTECH ICP plasma systems. Another highlight on graphene entitled “Challenges in graphene synthesis and semiconductor/graphene structures” was presented by Mr Lukosius from IHP Frankfurt/Oder. Other presentations reported on product technologies and application highlights.

Finally the participants of the seminar were invited to visit SENTECH’s application laboratories and manufacturing facility. Quoting some of the visitors, the seminar was described as very innovative and inspiring, the excellent networking opportunities were specially complimented.

SENTECH认为,受到2014年等离子体过程技术研讨会的成功的激励,他认为继续提供专门针对Sentech等离子体过程技术的研讨会。

The presentations and information are available by SENTECH upon request.
www.sentech-sales.com/en/contact-form

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