5月30日2015年
Advanced Semiconductor Engineering, Inc, the world’s largest semiconductor assembly and test service provider, today announced it will be showcasing System in Package (SiP) solutions in consumer applications at Computex 2015, scheduled to take place in Taipei, Taiwan, over June 2-5, 2015.
These SiP applications highlight the synergy between ASE’s IC packaging, material and test technologies, together with the strong expertise of Universal Scientific Industrial Shanghai Co, Ltd (USI; SHA: 601231) in module level manufacturing services to bring SiP into the realm of the Internet-of-Things (IoT).
SIP技术使多个半导体芯片和无源元件能够集成在更小，更紧凑的模块内，而不会影响整个封装或模块的功能和性能。因此，SIP可以理想地应用于许多当今消费技术，这些技术需要多种IC功能的异构集成，例如RF，处理器，存储器，传感器，电源管理，多媒体等，在非常紧密的空间约束中。
ASE在SIP的发展也用于保护环境，因为它减少了所需的制造步骤的数量。以前，每个设备功能都开发到各个IC芯片上，但是通过SIP技术，可以设计和直接嵌入到基板上，然后在模块上设计。制造步骤的减少导致在库存发货期间的物流管理中的效率降低，以及提高物流管理的效率。欧洲杯足球竞彩
To better serve the fast-growing IoT segment, ASE has evolved its business model by combining its technologies in wire bonding, wafer level, fan-out, flip chip, 2.5D/3D, substrates and embedded IC packaging with USI’s module level assembly to establish a strong leadership in SiP. ASE has also created a cohesive ecosystem for its SiP platform that included a key announcement with Inotera Memories Inc (April 7, 2014) on foundry service for 2.5D silicon interposer and TDK Corporation (May 8, 2015) for proprietary embedded substrate manufacturing. The collaboration within the supply chain has led to the development of a world class manufacturing technology that can be used in embedded solutions within smartphones, wearables, homes, connectivity and sensor applications.
在Computex与会者会发现所展示的这一合作在位于台北国际会议中心，数T203A的二楼ASE贵宾室的最终结果。上显示的展品将包括啮合照明（智能照明），其可以通过一个iPad，环境传感器，信标（微位置）技术来控制，穿戴式，连接和嵌入式基板技术。与会者将有机会看到的SiP解决方案是如何实现在多种应用，包括智能生活，连通性，数据管理和医疗诊断设备。
来源：http://www.aseglobal.com/