inistium Corporation'sRon Hunadi，市场开发经理，半导体和高级材料，将分享他的知识和专业知识欧洲杯足球竞彩IMAPS Advanced Technology Workshop and Tabletop Exhibition on Thermal Management, Oct. 25-27, in Los Gatos, Calif.
Hunadi’s presentation,用于非平板表面和燃烧/测试应用的专门金属TIM，讨论改进的热接口材料（TIM）的开发，这些材料（TIM）对于TIM2和燃烧测试应用都具有成本效益。欧洲杯足球竞彩
Hunadi’s presentation includes a review of thermal and performance data on HSMF and HSMF-OS. HSMF is a unique multilayer TIM that accommodates surface warpage over large areas, facilitates effective heat removal, and minimizes hot spots.
HSMF-OS is a 4-mil thick composition that contains an aluminum layer and a unique non-silicone thermal compound.
Hunadihas more than 20 years of experience in business development and microelectronics. He is responsible for developing new business opportunities and works closely with Indium Corporation's field sales and technical teams in Asia and the USA.
About Indium Corporation
Indium Corporation是全球电子，半导体，薄膜，热欧洲杯足球竞彩管理和太阳能市场的主要材料制造商和供应商。产品包括焊料和通量；橘子；热接口材料；欧洲杯足球竞彩溅射目标；酰化，甘露胶，鞘胶和锡金属和无机化合物；和纳米丝®。Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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