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Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, a dielectric constant of 2.91 at 1 KHz and a dissipation factor of 0.009 at 1KHz. “EP110F8-5 is an easy to use, heat curing epoxy that is ideal for applications where dimensional stability, electrical insulation properties and thermal cycling resistance are required,” said Rohit Ramnath, senior product engineer.
这两个组件环氧树脂具有重量的一到两个混合比，其中等混合粘度为7,000-11,000 CPS和良好的流量特性。它需要在4-6小时内以250-300°F的温度固化。EP110F8-5在室温下的锅寿命非常长2-3天。
EP110F8-5 is a rigid system with a Shore D hardness of 70-80, but also maintains excellent toughness and offers an elongation of 40-60%. Its toughness imparts an ability to withstand thermal cycling as well as impact and vibration. In fact, it passes 10 thermal shock cycles of -55°C to +125°C. With a compressive strength of 18,000-20,000 psi, EP110F8-5 adheres well to a wide variety of substrates, including metals, composites, glass and many plastics. It resists exposure to water, oils and fuels.
它可以在-100°F至 +300°F [-73°C至 +149°C]的宽温度范围内维修。EP110F8-5的A部分为棕褐色，B部分为棕色。该系统可用于½品脱，品脱，夸脱，加仑和5加仑容器套件。
Master Bond Epoxies with Dimensional Stability
Master Bond EP110F8-5 is a two part epoxy system for potting, sealing, encapsulation and casting applications with convenient handling, reliable electrical insulation properties and dimensional stability. Read more about Master Bond’s dimensionally stable adhesives at adhesives athttps://www.masterbond.com/properties/dimensionally-stable-poxy-hadhesives或联系技术支持。电话： +1-201-343-8983传真： +1-201-343-2132电子邮件：[email protected]