2018年8月22日
米特克（Mirtec）是“检查技术的全球领导者”，很高兴地宣布，它已与Comet Group的公司Yxlon签订了技术合作协议。这项合作使两个组织都可以探索和扩展SMT电子制造业中的协同应用。
上图，Mirtec和Yxlon设备在加利福尼亚州圣何塞的Comet2020欧洲杯下注官网 Group Lab One设施展出。This new ‘Center of Excellence’ gives customers the opportunity to enjoy hands-on experience and demonstrations with MIRTEC’s latest Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) Systems in conjunction with YXLON’s State-of-the-Art Automated X-Ray Inspection (AXI) Technology. These systems are fully integrated with the Award WinningSmartLoop产量改进系统。
MIRTEC, together with YXLON, have delivered a game-changing Industry 4.0 solution.SmartLooplinks MIRTEC’s in-line 3D AOI with the YXLON’s at-line digital X-Ray system, allowing data to flow between them seamlessly. Keith Bryant, YXLON Global Director of Electronics Sales stated, “3D AOI can only measure differences in Z-height on devices like BGAs and make a guestimate as to the quality of the joints underneath and the need for rework. WithSmartLoop, the at-line X-Ray system now becomes a verification station for the 3D height measurements taken by the AOI system. X-Ray inspection time is also dramatically reduced by targeting only suspect regions of interest that the system automatically selects for inspection. Full data integration gives the technician the tools needed for correct decisions, intelligent feedback and process improvements.”
MIRTEC北美销售和服务部总裁Brian D'Amico表示：“我们很高兴与Yxlon和Comet Group合作。我们的目的是将MITEC屡获殊荣的3D检查技术的优势与YXLON International的高级X射线和CT检验系统合作，为电子制造业的新检查解决方案进行合作。这些新的解决方案将为我们有价值的客户提供复杂的电子程序集生产所需的领先检查功能，并通过协作数据集成为行业4.0铺平道路。我们期待组织之间建立悠久而繁荣的关系”
Source:http://mirteceurope.com/