To support demand from high-growth markets like communications and sensors, InP processing capability is getting more advanced with a higher degree of automation, with the industry also looking to 6” to increase die per wafer.
Image Credit: Oxford Instruments Plasma Technology
牛津仪器正在利用其高温静电夹（HOT ESC）为plasmapro 100 Cobra ICP Etch模块的过渡，这是其ICP INP ETCH处理解决方案的市场领先范围的一部分。HOT ESC能力从75毫米晶圆尺寸及向上，是一种完整的兼容解决方案，可降低手动处理以提高可靠性和可重复性，这在较大的晶圆大小和更复杂的过程中至关重要。
牛津仪器已经开发了下一代硬件支持的前沿过程，并且该领先地位已得到1级客户的订单认可。该解决方案的需求量很高，并且可以启用自动化处理和较大的晶圆尺寸。优秀的INP市场增长预测和制造能力的扩大以满足预期需求的支持，欧洲和亚洲主要的光学模块和集成设备制造商的订单得到了支持。Datacom和电信将是市场上两个最大的细分市场，但是消费者和可穿戴的传感器也将为INP光子市场预期的收入14％带来吸引力的14％CAGR（Yole 2022）。
As market leading suppliers of InP processing equipment and solutions, we are attending Photonics West 2023 in San Francisco. Our experts will share the latest advances in optoelectronics, photonics, laser and quantum. Meet us there so we can discuss how our ICP InP process solutions and Ion Beam slanted facet etch capability can enhance your projects and meet your technical challenges.
来源：https://plasma.oxinst.com/